Jerome Neanne
Customer oriented system expert: Combine Software and Hardware skills to tackle issues
CAGNES SUR MER (06800) France
Professional Status
Employed
Open to opportunities
About Me
- Developped Software skills on top of Hardware background.
- Troubleshooter for complex system issues, personaly owned production stop debug cooperating directly with major customers. Always succeed to find a solution to recover production.
- Mentoring team engineers in day to day activities.
- Open source contributor.
System Engineer
Baylibre
Since December 2017
Full-time
Villeneuve Loubet
France
- TI Power management IC Linux & U-boot drivers development/validation/upstream: tps65219, tps6594.
- Zephyr driver: POC of porting a RF protocol (ESB) to a TeLink RiscV microcontroller.
- BL ACME on Zephyr: use tinyiiod zephyr porting to interface ACME probe on esp32 in place of Linux BeagleBB + cape
- NXP PowerTEC team: Low Power Audio development: MP3 playback custom implementation using audio subsystem block of imx845s. Hundreds mW down to 40mW. Released to production with Sony Walkman.
- NXP PTEC: automated portable test framework for power measurement on use cases: Measurement can be reproduced confidently across team/time.
- Thermo Regulated power Measurement Platform Definition, design and results study. Released open source. Presented at Embedded Linux Conference Lyon. Delivered to NXP and SiFive.
- Automated test framework development for rare audio glitches detection on analog output to enable debug (detection and log)
- PCIe Linux driver development: handle xDMA memory to memory transfers between Nvidia Xavier back-End and multiple Xilinx based board front-Ends with strong real time constraints.
- OTA update mender integration into yocto distribution. Implementation, validation and release to end customer.
- Mediatek IOT: power measurements and assessment on low power scenario (idle/suspend). Automated power measurement framework.
- Customer board schematics review.
Technical leader Integration team
Trustonic
November 2013
to August 2017
Full-time
Sophia
France
- In charge of integrating, testing and delivering TEE product for different product lines.
- Integration on platforms running various Rich OS: Android, Windows, Linux, "Yocto".
- Direct Interface with customers: Qualcomm, AMD, LGE. On Site for board bring-up or debug camp. Remote for day to day activity.
- TEE Core Feature development on customer request: MTK relocation, DRM Extension, Built-in capabilities for product/Test package.
- Android secure framework: TA and Secure Driver development for AndroidO TeeKeyMaster3 (Verified Boot, Attestation and Gatekeeper).
- DRM: Secure driver development for Qualcomm platforms using secure video path dedicated features.
- Optimization: minimize memory requirements for running TEE on low end devices. Maximize performance by relocating critical section.
- Test development: Test definition. Create Normal and Secure World components (Trusted Application and Drivers). functional testing and performance benchmarking.
- QA: Integrate new devices into Continuous Integration farm. Analysis and debug of existing tests on various platforms. Integrate latest Android CTS into test framework.
Principal Engineer in application team: Application processor expert.
Texas Instruments
January 2010
to July 2013
Full-time
Villeneuve Loubet
France
- Focus on the resolution of the most critical customer system issues. Join on site debug camps , interface with customer and provide solution to enable production ramp. Innovate through PE forum. Promote best practice within the team.
- Customer on site support, enabling production ramp:
Samsung Superior (September 2012) T1(June 2011), LG optimus3D (April 2012), Google GED & Phantasm (July 2011)RIM/QNX playbook (March 2011). - Provide guidance for customer to achieve ultimate performance based on thermal performance of their product (Apps note generation & Consulting).
- Define a methodology for System margin validation & compensation on customer board.
Technical lead for Level 2 support
Texas Instruments
January 2006
to January 2010
Villeneuve-Loubet
- In charge of a support team (5 people), technical lead and coordination.
- Customer on site support Motorola USB DMA stall 2010, Nokia N900 PLD issue Nov 2009 and 3 different production stop crisis with Samsung (January09, March and May).
- Assigning and driving team resources for issue resolution (870 requests closed), personal investment on most critical/complex investigation. Ramping successfully various customers in parallel: Palm Pre (2Q09) roadrunner (3Q10), Samsung OMNIA HD(3Q09) Archer (3Q10) S1 (RTP 4Q10), Nokia N900(4Q09), SEMC SATIO (1Q10), Mot Milestone (4Q09) DroidX (3Q10), Fujitsu Spinach (3Q10) Brutus (RTP 4Q10), Archos 5(4Q08).
- Personally tackle 200 support requests on OMAP3.
Technical Lead for OMAP242x support activity.
Texas Instruments
January 2003
to January 2006
Villeneuve Loubet
- Personally tackle 320 support requests on OMAP2420. Lead team to achieve a total of 1450 requests resolved. On site support at NEC.
- In charge of definition of new TRM quality guidelines after customer complain about previous TRM quality. (2003-2004)
System On Chip Digital Electronic Designer.
Texas Instruments
January 2000
to January 2003
Villeneuve-Loubet
- Electronic design using VHDL/Verilog, synthesis, Implementation and functional specification, validation of the features in simulation environment.
- Top level integration of OMAP730 (One die Modem + APP), Top, Core and Conf module generation.
- Designer on OMAP1510, first OMAP product on the market.
Common core in Electronic and Computer Sciences. Specialization: Architecture & Integration in electronic.
Learn more
- Security: TEE, Trusted Firmware, booting, secure video path, Hardware-backed keystore.
- ARM Cortex architecture: Trust Zone, SMP, cache.
- Memory: DDR, memory controller, flash, eMMC.
- Thermal: junction policy, skin temperature containment methods.
- Power management: DVFS, AVS, power domain partitioning, idle management.
- Interconnect: architecture, protocol.
- Lauterbach, Trace, ADB, simulation RTL/Gate, Lab material.
- Patent TI-37336 (granted 2009): System and method for secure mode for processors and memories on multiple semiconductors dies within a single semiconductor package
- TPMP inventor
- Embedded Linux Conference presenter
- Trained more than 250 people on OMAP systems (Customers, FAEs, TI employees)
- Ability to scale description depending on audience expectations.
- Support team lead
- Task force lead
- Software: C, Assembly(ARM), Python, Ruby, Shell, Pearl.
- Hardware: VHDL, Verilog.
- Build environments: Maven, Android, Yocto.
- Version control: GIT, SVN, Clearcase
- Continous Integration: Jenkins, Nexus
- Documentation: Sphynx, xml.
- Architectures: ARM processors, RISCV microcontrollers.
- Linux: Drivers
- U-boot: Drivers
- Zephyr: Drivers
- TEE: Kernel dev and secure drivers.
- TI: Jacinto 7, am62/64, Beagle
- Nvidia: Jetson Xavier
- NXP: IMX8 derivatives
- Nordic: nRF52840
- Telink: TLSR9518
- Mediatek: Pumpkins i350, i500
