10 years of experience on advanced IC-PKG-PCB co-design. Coordinating every actor of the implementation to get a full-custom package solution with the best Performance/Cost ratio for the system. Improving the flow to help delivering the best product quality and user experience possible.
System In Package implementation for digital baseband and modem SOC (in 45/40nm and 32/28nm, bulk and FD-SOI).
Close collaboration with back-end, architecture, CAD providers, PCB, SI/PI and packaging teams on multisite to provide best quality and best cost designs.
New activity for the company, strong need to interact with tool vendors and methodology team to develop the flow and improve the reliability and possibilities. Loads of test-cases and specifications exchanged with the tool developers.
